News
Contact



Address : Jiwei Road, Taian City, Shandong Province, China
Tel : 86-0538-6711962    
Fax : 86-0538-8568234
Email :  sales@staremt.com

              info@staremt.com

              henry@staremt.com

Mobile : 86-18253806479

Product

back>>

Semiconductive Shield Compound

  date:2017-04-21 21:59:25  

Description
 With  polyolefin as basic material, semiconductive shield compound is mixed with the  conductive carbon black, crosslinking agent, and other additives. It can be  used in the conductor shield of power cable(inner shield).
 With  polyolefin as basic material, semiconductive shield compound is granulated by  mixing with the conductive carbon black, crosslinking agent, and other  additives. It can be used in the outer shield of crosslinked power cable.


Catalog

Type

 Name

Use

PYJD-10

Crosslinkable    semiconductive shield compound

10KV    cable core and insulating shield

PYJD-35

Crosslinkable    semiconductive shield compound

35KV    cable core and insulating shield

PYJBJ-10

Crosslinkable    Semiconductive shield compound

10KV    cable insulating shield

PYJBJ-35

Crosslinkable    Semiconductive shield compound

35KV    cable insulating shield

PYJJ-35

Crosslinkable    Semiconductive shield compound

35KV    cable insulating shield

PSD-10

Thermoplastics    semiconductive shield compound

10KV    cable core shield


Technical  Parameter

No.

Item

Unit

Specification

PYJD

PYJBJ

PYJJ

PSD

1

Density

g/cm3

≤1.20

≤1.20

≤1.20

≤1.20

2

Tensile    strength

Mpa

≥12.0

≥10.0

≥10.0

≥10.0

3

Elongation    at break

%

≥200

≥200

≥200

≥200



4


Oven    aging experiment
(experiment    condition:
temperature    135+/-2℃,    duration 168h, except PSD experiment temperature 100+/-2℃, duration 240h)

Variation of    tensile strength

%

+/-30

+/-30

+/-30

+/-30

Variation of    elongation at break


%


+/-30


+/-30


+/-30


+/-30


5


Impact    embrittlement ability
(experiment temperature -40℃, except PSD    experiment temperature-10℃)


Failure    number


≤15/30


≤15/30


≤15/30


≤15/30



6


Heat    drawing
(experiment    condition: temperature 200+/-2℃,    mechanical load0.2Mpa, load time15Min)


Elongation    at load

%

≤100

≤100

≤100

-

Residual    elongation after cooling

%

15

≤15

≤15

-

7

Volume    resistivity at 20℃

Ω.cm

≤100

≤100

≤100

≤100

8

Volume    resistivity at 90℃(70℃)

Ω.cm

≤5000

≤2500

≤2500

≤1000


9

Volume    resistivity after oven ageing
(experiment    condition: ageing temperature 100+/-2℃,     duration 168h)

Ω.cm

≤1000

≤500

≤500

≤1000

10

Peel    strength

N/cm

-

10-45

-

-