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Product
back>>Semiconductive Shield Compound
Description
With polyolefin as basic material, semiconductive shield compound is mixed with the conductive carbon black, crosslinking agent, and other additives. It can be used in the conductor shield of power cable(inner shield).
With polyolefin as basic material, semiconductive shield compound is granulated by mixing with the conductive carbon black, crosslinking agent, and other additives. It can be used in the outer shield of crosslinked power cable.
Catalog
Type | Name | Use |
PYJD-10 | Crosslinkable semiconductive shield compound | 10KV cable core and insulating shield |
PYJD-35 | Crosslinkable semiconductive shield compound | 35KV cable core and insulating shield |
PYJBJ-10 | Crosslinkable Semiconductive shield compound | 10KV cable insulating shield |
PYJBJ-35 | Crosslinkable Semiconductive shield compound | 35KV cable insulating shield |
PYJJ-35 | Crosslinkable Semiconductive shield compound | 35KV cable insulating shield |
PSD-10 | Thermoplastics semiconductive shield compound | 10KV cable core shield |
Technical Parameter
No. | Item | Unit | Specification | |||||
PYJD | PYJBJ | PYJJ | PSD | |||||
1 | Density | g/cm3 | ≤1.20 | ≤1.20 | ≤1.20 | ≤1.20 | ||
2 | Tensile strength | Mpa | ≥12.0 | ≥10.0 | ≥10.0 | ≥10.0 | ||
3 | Elongation at break | % | ≥200 | ≥200 | ≥200 | ≥200 | ||
4 | Oven aging experiment | Variation of tensile strength | % | +/-30 | +/-30 | +/-30 | +/-30 | |
Variation of elongation at break | % | +/-30 | +/-30 | +/-30 | +/-30 | |||
5 | Impact embrittlement ability | Failure number | ≤15/30 | ≤15/30 | ≤15/30 | ≤15/30 | ||
6 | Heat drawing | Elongation at load | % | ≤100 | ≤100 | ≤100 | - | |
Residual elongation after cooling | % | 15 | ≤15 | ≤15 | - | |||
7 | Volume resistivity at 20℃ | Ω.cm | ≤100 | ≤100 | ≤100 | ≤100 | ||
8 | Volume resistivity at 90℃(70℃) | Ω.cm | ≤5000 | ≤2500 | ≤2500 | ≤1000 | ||
9 | Volume resistivity after oven ageing | Ω.cm | ≤1000 | ≤500 | ≤500 | ≤1000 | ||
10 | Peel strength | N/cm | - | 10-45 | - | - |